1. Differences in production processes:

The wire wound chip inductor is based on the traditional production process of wire wound inductors, which transforms the plug-in inductor into a chip packaging, reducing the volume of the inductor and making it more convenient to use.

The SMD laminated inductor is made using multi-layer printing technology and laminated production process.

2. Performance differences:

3. Price difference: The production of stacked inductors is difficult, with high technical requirements, high production costs, and higher prices than wound inductors.

4. Other differences: The heat dissipation of the SMD stack inductor is better than that of the wound SMD inductor. The SMD stack inductor cannot see the wires, and has better resistance to inductance interference, heat dissipation, and installation space saving compared to the SMD winding inductor.